Datasheet
MAX9737
Mono 7W Class D Amplifier
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
PVDD
= 12V, V
AGND
= V
PGND
= 0, V
SHDN
= V
MUTE
= 5V, C1 = 0.1µF, C
IN
= 0.47µF, C2 = C
COM
= C
REG
= 1µF, R
IN
= R
FB
= 20kΩ,
R
L
= ∞, AC measurement bandwidth 22Hz to 22kHz, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.)
(Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PVDD to PGND.......................................................-0.3V to +30V
AGND to PGND .....................................................-0.3V to +0.3V
IN, PRE, PC, COM to AGND.....................-0.3V to (V
REG
+ 0.3V)
MUTE, SHDN to AGND ............................................-0.3V to +6V
REG to AGND ...............................................-0.3V to (V
S
+ 0.3V)
V
S
to AGND ..............................................................-0.3V to +6V
OUT+, OUT- to PGND .............................-0.3V to (PVDD + 0.3V)
C1N to PGND ..........................................-0.3V to (PVDD + 0.3V)
C1P to PGND .........................(PVDD - 0.3V) to (V
CHOLD
+ 0.3V)
CHOLD to PGND .......................................(V
C1P
- 0.3V) to +36V
OUT+, OUT-, Short Circuit to PGND or PVDD ...........Continuous
Thermal Limits (Notes 1, 2)
Continuous Power Dissipation (T
A
= +70°C)
24-Pin TQFN Single-Layer PCB (derate 20.8mW/°C
above +70°C)........................................................1666.7mW
θ
JA
................................................................................48°C/W
θ
JC
..................................................................................3°C/W
Continuous Power Dissipation
24-Pin TQFN Multiple-Layer PCB
(derate 27.8mW/°C above +70°C)........................2222.2mW
θ
JA
................................................................................36°C/W
θ
JC
..................................................................................3°C/W
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
AMPLIFIER DC CHARACTERISTICS
Speaker-Supply Voltage Range PVDD Inferred from PSRR test 8 28 V
Undervoltage Lockout UVLO 6.8 V
T
A
= +25°C 15 20
Quiescent Supply Current I
PVDD
25
mA
Shutdown Supply Current I
SHDN
V
SHDN
= 0, T
A
= +25°C 1 10 µA
REG Voltage V
REG
4.0 4.2 4.5 V
Preregulator Voltage V
S
4.85 V
COM Voltage V
COM
1.94 2.06 2.16 V
INPUT AMPLIFIER CHARACTERISTICS
Capacitive Drive C
L
No sustained oscillation 30 pF
Output Swing Sinking ±1mA (Note 4) 2.05 V
Open-Loop Gain A
VO
88 dB
Input Offset Voltage V
OS
IN to COM ±2 mV
Input Amplifier Slew Rate 2.5 V/µs
Input Amplifier Unity-Gain
Bandwidth
3.5 MHz
Note 1: Thermal performance of this device is highly dependent on PCB layout. See the
Applications Information
section for more detail.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.