Datasheet

Low-Power, Low-Offset, Dual Mode, Class H
DirectDrive Headphone Amplifier
MAX97200
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PVIN or PVDD to PGND .......................................-0.3V to +2.2V
GND to PGND
......................................................-0.3V to +0.3V
PVSS to PGND
.....................................................-2.2V to +0.3V
OUT_ and IN_ to GND
............. (PVSS - 0.2V) to (PVDD + 0.2V)
C1P, C1N
...................................................Cap connection only
SHDN to GND
.........................................................-0.3V to +4V
Output Short-Circuit Current
.....................................Continuous
Thermal Limits (Note 1)
Multiple Layer PCB
Continuous Power Dissipation (T
A
= +70NC)
12-Bump WLP (derate 13.7mW/NC above +70NC) ....1095mW
Junction Temperature .................................................+150NC
Operating Temperature Range
.......................... -40NC to +85NC
Storage Temperature Range
............................ -65NC to +150NC
Soldering Temperature (reflow)
......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
PVIN
= 1.8V, V
PGND
= V
GND
= 0V, V
SHDN
= 1.8V, C1 = C2 = C3 = 1FF, C4 = 10FF, T
A
= T
MIN
to T
MAX
, unless otherwise noted.
Typical values are at T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (B
JA
) ..............73NC/W
Junction-to-Case Thermal Resistance (B
CA
) ..................30NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage Range PVIN Guaranteed by PSRR 1.62 1.80 1.98 V
UVLO Rising 1.48 1.58 V
UVLO Falling 1.36 1.46 V
Quiescent Supply Current I
DD
Inputs grounded, T
A
= +25NC, no load
1.15 1.7
mA
16I load, inputs grounded, T
A
= +25NC
1.16
Shutdown Current
I
SHDN
V
SHDN
= 0V, T
A
= +25NC
0.2
FA
Turn-On Time t
ON
0.6 1 ms
CHARGE PUMP
Oscillator Frequency f
OSC1
V
OUT
= 0V, T
A
= +25NC
78 83 88 kHz
Oscillator Frequency f
OSC2
V
OUT
= 0.2V, R
L
= J, f
IN
= 1kHz
665 kHz
Oscillator Frequency f
OSC3
V
OUT
= 0.5V, R
L
= J, f
IN
= 1kHz
500 kHz
Positive Output Voltage V
PVDD
V
OUT
= 0.2V, R
L
= J
PVIN/2
V
V
OUT
= 0.5V, R
L
= J
PVIN
Negative Output Voltage V
PVSS
V
OUT
= 0.2V, R
L
= J
-PVIN/2
V
V
OUT
= 0.5V, R
L
= J
-PVIN
Output Voltage Threshold V
TH1
R
L
= J, output voltage at which the
charge pump switches modes, V
OUT
rising, transition from 1/8 to normal
frequency
QPVIN
x
0.08
V