Datasheet
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE NO.
LAND
PATTERN
NO.
56 TQFN-EP T5688-3 21-0135 90-0047
TOP VIEW
PGND
PGND
PGND
PV
DD
PV
DD
PV
DD
TH0
TH1
TH2
G2
TEMP
MUTE
SHDN
N.C.
36
37
38
39
40
32
33
34
35
41
18
19
20
21
22 23 24 25 26 27
OUTL+
THIN QFN
30
31
29
INR+
INR-
V
DD
SS
GND
GND
REG
REG
REG
FS1
15 16 17
MONO
INL+
INL-
OUTL-
OUTL-
PGND
PGND
OUTR+
N.C.
N.C.
OUTL+
OUTR+
OUTR-
OUTR-
N.C.
28
G1 N.C.
SYNCOUT
CPV
DD
C1P
C1N
PV
DD
PV
DD
FS2
SYNCIN
N.C.
PV
DD
PGND
PGND
PGND
N.C.
42
7
6
5
4
3
11
10
9
8
2
13
12
14
1
53
52
51 50 49 48 47 46 45 44
56 55 54
43
MAX9709
+
MAX9709 25W/50W, Filterless, Spread-Spectrum,
Stereo/Mono, Class D Amplier
www.maximintegrated.com
Maxim Integrated
│
19
Pin Congurations
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.