Datasheet

2 Maxim Integrated
3V/5V Low-Power, Low-Noise, CMOS,
Rail-to-Rail I/O Op Amps
MAX9636/MAX9637/MAX9638
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
V
DD
, SHDN to V
SS
..................................................-0.3V to +6V
IN+, IN-, OUT ....................................GND - 0.3V to V
DD
+ 0.3V
Continuous Input Current (any pins) ............................... Q20mA
Output Short Circuit to V
DD
or V
SS
Duration .......................... 5s
Thermal Limits (Note 1)
Multiple Layer PCB
Continuous Power Dissipation (T
A
= +70NC)
6-Pin SC70 (derate 3.1mW/°C above +70NC) ............245mW
B
JA
....................................................................... 326.5°C/W
B
JC
.........................................................................115°C/W
8-Pin SC70 (derate 3.1mW/NC above +70NC) ............. 245mW
B
JA
.........................................................................326°C/W
B
JC
.........................................................................115NC/W
10-Pin UTQFN (derate 7mW/NC above +70NC) ........558.7mW
B
JA
......................................................................143.2NC/W
B
JC
......................................................................... 20.1NC/W
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature ....................................................+150NC
Lead Temperature (soldering 10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
DD
= 3.3V, V
SS
= 0V, V
IN+
= V
IN-
= V
CM
= V
DD
/2, R
L
= 10kI to V
DD
/2, SHDN = V
DD
, T
A
= -40NC to +125NC. Typical values are
at T
A
= +25NC, unless otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Input Voltage Range V
IN+
, V
IN-
Guaranteed by CMRR
V
SS
-
0.1
V
DD
+
0.1
V
Input Offset Voltage V
OS
T
A
= +25NC 0.01 2.2
mV
T
A
= -40NC to +125NC 3.5
Input Offset Voltage Drift
(Note 3)
TCV
OS
MAX9636 only 7
FV/NC
MAX9637, MAX9638 only 10
Input Bias Current (Note 3) I
B
T
A
= +25NC ±0.1 ±0.8
pA
T
A
= -40NC to +85NC ±50
T
A
= -40NC to +125NC ±800
Common-Mode Rejection Ratio CMRR
V
SS
< V
CM
<
(V
DD
- 1.4V)
T
A
= +25NC 72 86
dB
T
A
= -40NC to +125NC 68
(V
SS
- 0.1V) < V
CM
< (V
DD
+ 0.1V) 58 77
Open-Loop Gain A
OL
V
OUT
= 0.25V from rails 104 124
dB
V
OUT
= 0.4V from rails, R
L
= 600I 100 120
Output Short-Circuit Current I
SC
Short to V
DD
55
mA
Short to V
SS
40
Output Voltage Low V
OL
V
OUT
R
L
= 10kI 0.014 0.03
V
R
L
= 600I 0.044 0.08
Output Voltage High V
OH
V
DD
- V
OUT
R
L
= 10kI 0.019 0.04
V
R
L
= 600I 0.057 0.1
Output Leakage in Shutdown
SHDN = V
SS
, V
OUT
= 0V to V
DD
(MAX9636,
MAX9638 only)
0.01 1 FA