Datasheet
2 Maxim Integrated
Dual 36V Op Amp for 18-Bit
SAR ADC Front-End
MAX9633
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (V
CC
to V
EE
).................................-0.3V to +40V
All Other Pins ..................................(V
EE
- 0.3V) to (V
CC
+ 0.3V)
Short-Circuit Duration of OUTA, OUTB ................................. 10s
Continuous Input Current (any pins) ............................... ±20mA
Continuous Power Dissipation (T
A
= +70NC)
SO (derate 24.4mW/NC above +70NC)
Multilayer Board .....................................................1951.2mW
TDFN (derate 24.4mW/NC above +70NC)
Multilayer Board ........................................................1905mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
= +15V, V
EE
= -15V, V
CM
= 0V, R
L
= 10kI to V
GND
= 0V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at
T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
SO-EP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........41°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................7°C/W
TDFN-EP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........42°C/W
Junction-to-Case Thermal Resistance (q
JC
) .................8°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage Rang
e
V
CC
- V
EE
Guaranteed by PSRR 4.5 36 V
Supply Current I
CC
Per amplifier
T
A
= +25NC
3.5 5
mA
-40NC P T
A
P +85NC
6
-40NC P T
A
P +125NC
6.5
Power-Supply Rejection Ratio PSRR
+4.5V P (V
CC
- V
EE
)
P +36V
T
A
= +25NC
112 135
dB
-40NC P T
A
P +125NC
110
DC SPECIFICATIONS
Input Offset Voltage V
OS
T
A
= +25NC Q70 Q200
FV
-40NC P T
A
P +125NC Q290
Input Offset Voltage Drift
(Note 3)
DV
OS
-40NC P T
A
P +125NC
0.2 0.9
FV/NC
Input Bias Current I
B
(V
EE
+ 0.45V) P V
CM
P (V
CC
- 1.8V) Q42 Q400
nA
V
EE
P V
CM
P (V
CC
- 1.8V)
4.5 22
FA
Input Offset Current I
OS
(V
EE
+ 0.45V) P V
CM
P (V
CC
- 1.8V) Q30 Q300
nA
V
EE
P V
CM
P (V
CC
- 1.8V) Q200 Q2000
Input Voltage Range V
IN+
, V
IN-
Guaranteed by CMRR
T
A
= +25NC
V
EE
V
CC
-
1.7
V
-40NC P T
A
P
+125NC
V
EE
V
CC
-
1.8
Common-Mode Rejection Ratio CMRR
V
EE
P V
CM
P (V
CC
- 1.7V), T
A
= +25NC
106 130
dB
V
EE
P V
CM
P (V
CC
- 1.8V), -40NC P T
A
P
+125NC
105 130