Datasheet

2 ______________________________________________________________________________________
MAX9613/MAX9615
Low-Power, High-Efficiency,
Single/Dual, Rail-to-Rail I/O Op Amps
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN+, IN-, SHDN, V
CC
to GND..................................-0.3V to +6V
OUT to GND ............................................. -0.3V to (V
CC
+ 0.3V)
Short-Circuit (GND) Duration to Either Supply Rail ................. 5s
Continuous Input Current (any pin) ................................. Q20mA
Thermal Limits (Note 1) Multilayer PCB
Continuous Power Dissipation (T
A
= +70NC)
6-Pin SC70 (derate 3.1mW/NC above +70NC) .............245mW
B
JA
.......................................................................326.5NC/W
B
JC
..........................................................................115NC/W
8-Pin SC70 (derate 3.1mW/NC above +70NC) .............245mW
B
JA ..........................................................................
326NC/W
B
JC
..........................................................................115NC/W
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
CC
= V
SHDN
= 3.3V, V
IN+
= V
IN-
= V
CM
= 0V, R
L
= 10kI to V
CC
/2, T
A
= -40NC to +125NC. Typical values are at T
A
= +25NC, unless
otherwise noted.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Input Voltage Range V
IN+
, V
IN-
Guaranteed by CMRR test -0.1
V
CC
+
0.1
V
Input Offset Voltage V
OS
T
A
= +25NC
23 100
FV
T
A
= -40NC to +125NC after power-up auto-
calibration
150
T
A
= -40NC to +125NC
750
Input Offset Voltage Drift V
OS
- TC 1 7
FV/NC
Input Bias Current (Note 3) I
B
T
A
= +40°C to +25°C
1 1.55
pA
T
A
= +70°C
45
T
A
= +85°C
135
T
A
= +125°C
1.55 nA
Common-Mode Rejection Ratio CMRR
V
CM
= -0.1V to V
CC
+ 0.1V, T
A
= +25NC
82 100
dB
V
CM
= -0.1V to V
CC
+ 0.1V, T
A
= -40NC to
+125NC
80
Input Offset Current (Note 3) I
OS
T
A
= +40°C to +25°C
0.5
pA
T
A
= +70°C
7
T
A
= +85°C
25
T
A
= +125°C
400
Open-Loop Gain A
OL
+0.4V P V
OUT
P V
CC
- 0.4V, R
L
= 10kI
99 120 dB
Output Short-Circuit Current
(Note 4)
I
SC
To V
CC
275
mA
To GND 75
Output Voltage Low V
OL
R
L
= 10kI
0.011
V
R
L
= 600I
0.1
R
L
= 32I
0.170