Datasheet

MAX9406
DisplayPort to DVI™/HDMI Level Shifter
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 3V to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 3.3V, T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND..............................................................-0.3V to +4V
All Pins to GND...........................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration (all outputs).............................Continuous
Continuous Power Dissipation (T
A
= +70°C)
32-Pin Thin QFN (derate 21.3mW/°C above +70°C) .1702mW
48-Pin Thin QFN (derate 27.8mW/°C above +70°C) .2222mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 1)
32-Pin Thin QFN........................................................+1.7°C/W
48-Pin Thin QFN........................................................+0.8°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 1)
32-Pin Thin QFN.........................................................+29°C/W
48-Pin Thin QFN.........................................................+25°C/W
Operating Temperature Range ..…………………-40°C to +85°C
Junction Temperature ………………………………………+150°C
Storage Temperature Range ……………………-65°C to +150°C
ESD Protection
Human Body Model (R
D
= 1.5kΩ, C
S
= 100pF)
IN_D_ and OUT_D_ to GND..........................................±1.5kV
Lead Temperature (soldering, 10s).………………………+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
OE INPUT
Input High Level V
IH1
2.4 V
Input Low Level V
IL1
0.5 V
Input Current I
IN-EN
V
IN
= 0 to V
CC
24 µA
DDC_EN INPUT
Input High Level V
IH1
2.4 V
Input Low Level V
IL1
0.5 V
Input Current I
IN-DDC
V
IN
= 0 to V
CC
100 µA
HPD INPUT AND OUTPUT
Input High Level V
IH2
2.4 5.3 V
Input Low Level V
IL2
0.8 V
Input Current I
IN2
V
IN
= 0 to V
CC
80 µA
HPD_SNK Pulldown Resistance R
HPD
40 60 kΩ
Output High Level V
OH-HPDB
2.5 V
CC
V
Output Low Level V
OL-HPDB
0 0.18 0.4 V
DIFFERENTIAL INPUTS (IN_)
Differential Input High Threshold V
IDH
V
ID
= V
IN+
- V
IN-
50 mV
Differential Input Low Threshold V
IDL
V
ID
= V
IN+
- V
IN-
-50 mV
Common Input Voltage V
COM
V
COD
= DC Avg [(V
IN+
+ V
IN-
) / 2] 0 1.43 2 V
Common-Mode AC Tolerance V
C M _A C _P - P
V
CM_AC_P-P
= (V
IN+
+ V
IN-
) / 2 - V
COD
100 mV
Differential Input Termination R
IN
40 60 Ω
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board.
For detailed information on package thermal considerations, refer to
Application Note 4083 at www.maxim-ic.com/thermal-tutorial.