Datasheet

MAX9273
22-Bit GMSL Serializer with Coax or
STP Cable Drive
6Maxim Integrated
AVDD to EP ..........................................................-0.5V to +1.9V
DVDD to EP ..........................................................-0.5V to +1.9V
IOVDD to EP ......................................................... -0.5V to +3.9V
OUT+, OUT- to EP ...............................................-0.5V to +1.9V
All other pins to EP .............................. -0.5V to (V
IOVDD
+ 0.5V)
OUT+, OUT- short circuit to ground or supply ........Continuous
*EP connected to PCB ground.
Continuous Power Dissipation (T
A
= +70NC)
TQFN (derate 37mW/NC above +70NC).....................2963mW
Junction Temperature .....................................................+150NC
Operating Temperature Range ........................-40
o
C to +105NC
Storage Temperature Range ............................-65
o
C to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (q
JA
) ..........27°C/W Junction-to-Case Thermal Resistance (q
JC
) .....................1°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
DC ELECTRICAL CHARACTERISTICS
(V
AVDD
= V
DVDD
= 1.7V to 1.9V, V
IOVDD
= 1.7V to 3.6V, R
L
= 100I ±1% (differential), EP connected to PCB ground (GND),
T
A
= -40NC to +105NC, unless otherwise noted. Typical values are at V
AVDD
= V
DVDD
= V
IOVDD
= 1.8V, T
A
= +25NC.)
*
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SINGLE-ENDED INPUTS (DIN_, HS, VS, MS, PWDN, DRS, AUTOS, PCLKIN)
High-Level Input Voltage V
IH1
0.65 x
V
IOVDD
V
Low-Level Input Voltage V
IL1
0.35 x
V
IOVDD
V
Input Current I
IN1
V
IN
= 0V to V
IOVDD
-10 +20
FA
THREE-LEVEL LOGIC INPUTS (CONF0, CONF1)
High-Level Input Voltage V
IH
0.7 x
V
IOVDD
V
Low-Level Input Voltage V
IL
0.3 x
V
IOVDD
V
Midlevel Input Current I
INM
(Note 2) -10 +10
FA
Input Current I
IN
-150 +150
FA
SINGLE-ENDED OUTPUT (GPO)
High-Level Output Voltage V
OH1
I
OUT
= -2mA
V
IOVDD
- 0.2
V
Low-Level Output Voltage V
OL1
I
OUT
= 2mA 0.2 V
Output Short-Circuit Current I
OS
V
O
= 0V
V
IOVDD
= 3.0V to 3.6V 16 35 64
mA
V
IOVDD
= 1.7V to 1.9V 3 12 21