Datasheet

27-Bit, 2.5MHz to 42MHz
DC-Balanced LVDS Deserializers
2 Maxim Integrated
MAX9248/MAX9250
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(V
CC_
= +3.0V to +3.6V, PWRDWN = high, differential input voltage ⏐V
ID
⏐ = 0.05V to 1.2V, input common-mode voltage V
CM
= ⏐V
ID
/ 2⏐
to V
CC
- ⏐V
ID
/ 2⏐, T
A
= -40°C to +105°C, unless otherwise noted. Typical values are at V
CC_
= +3.3V, ⏐V
ID
⏐ = 0.2V, V
CM
= 1.2V,
T
A
= +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC_
to _GND........................................................-0.5V to +4.0V
Any Ground to Any Ground...................................-0.5V to +0.5V
IN+, IN- to LVDSGND............................................-0.5V to +4.0V
IN+, IN- Short Circuit to LVDSGND or V
CCLVDS
........Continuous
(R/F, OUTEN, RNG_, REFCLK, SS
PWRDWN) to GND................................. -0.5V to (V
CC
+ 0.5V)
(RGB_OUT[17:0], CNTL_OUT[8:0], DE_OUT, PCLK_OUT,
LOCK) to V
CCOGND
.............................-0.5V to (V
CCO
+ 0.5V)
Continuous Power Dissipation (T
A
= +70°C)
48-Lead LQFP (derate 21.7mW/°C above +70°C).....1739mW
ESD Protection
Machine Model (R
D
= 0Ω, C
S
= 200pF)
All Pins to GND............................................................±200V
Human Body Model (R
D
= 1.5kΩ, C
S
= 100pF)
All Pins to GND..............................................................±2kV
ISO 10605 (R
D
= 2kΩ, C
S
= 330pF)
Contact Discharge (IN+, IN-) to GND ............................±10kV
Air-Gap Discharge (IN+, IN-) to GND ............................±30kV
IEC 61000-4-2 (R
D
= 330Ω, C
S
= 150pF)
Contact Discharge (IN+, IN-) to GND ............................±10kV
Air-Gap Discharge (IN+, IN-) to GND ............................±15kV
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (R/F, OUTEN, RNG0, RNG1, REFCLK, PWRDWN, SS)
High-Level Input Voltage V
IH
2.0
V
CC
+ 0.3
V
Low-Level Input Voltage V
IL
-0.3
+0.8
V
V
I N
= - 0.3V to 0 ( M AX 9248/
M AX 9250E C M ) ,
V
I N
= - 0.15V to 0 ( M AX 9248/
M AX 9250G C M ) ,
-100
+20
Input Current I
IN
PWRDWN =
high or low
V
IN
= 0 to (V
CC
+ 0.3V) -20 +20
µA
Input Clamp Voltage V
CL
I
CL
= -18mA -1.5 V
SINGLE-ENDED OUTPUTS (RGB_OUT[17:0], CNTL_OUT[8:0], DE_OUT, PCLK_OUT, LOCK)
I
OH
= -100µA V
CCO
- 0.1
I
OH
= -2mA, RNG1 = high V
CCO
- 0.35High-Level Output Voltage V
OH
I
OH
= -2mA, RNG1 = low V
CCO
- 0.4
V
I
OL
= 100µA 0.1
I
OL
= 2mA, RNG1 = high 0.3
Low-Level Output Voltage V
OL
I
OL
= 2mA, RNG1 = low
0.35
V
High-Impedance Output Current
I
OZ
PWRDWN = low or OUTEN = low,
V
O
= -0.3V to (V
CCO
+ 0.3V)
-10 +10 µA
RNG1 = high, V
O
= 0 -10 -50
Output Short-Circuit Current I
OS
RNG1 = low, V
O
= 0 -7 -40
mA