Datasheet

MAX9209/MAX9213
Programmable DC-Balanced
21-Bit Serializers
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, R
L
= 100Ω±1%, PWRDWN = high, DCB/NC = high or low, unless otherwise noted. Typical values are at V
CC
= +3.3V, T
A
= +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND...........................................................-0.5V to +4.0V
LVDS Outputs (TxOUT_, TxCLK OUT_) to GND ...-0.5V to +4.0V
5V Tolerant LVTTL/LVCMOS Inputs
(TxIN_, TxCLK IN, PWRDWN) to GND ..............-0.5V to +6.0V
(DCB/NC) to GND ......................................-0.5V to (V
CC
+ 0.5V)
LVDS Outputs (TxOUT_, TxCLK OUT_)
Short to GND and Differential Short .......................Continuous
Continuous Power Dissipation (multilayer board, T
A
= +70°C)
48-Pin TSSOP (derate 16mW/°C above +70°C) ....... 1282mW
48-Pin TQFN (derate 40mW/°C above +70°C) ..........3200mW
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
ESD Protection
Human Body Model (R
D
= 1.5kΩ, C
S
= 100pF)
All Pins to GND..............................................................±2kV
IEC 61000-4-2 (R
D
= 330Ω, C
S
= 150pF)
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..±15kV
ISO 10605 (R
D
= 2kΩ, C
S
= 330pF)
Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....±8kV
Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..±25kV
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SINGLE-ENDED INPUTS (TxIN_, TxCLK IN, PWRDWN, DCB/NC)
TxIN_, TxCLK IN, PWRDWN 2.0 5.5
High-Level Input Voltage V
IH
DCB/NC 2.0
V
CC
+
0.3
V
Low-Level Input Voltage V
IL
-0.3 +0.8 V
Input Current I
IN
V
IN
= hi g h or l ow , P WRDWN = hi g h or l ow -20 +20 µA
Input Clamp Voltage V
CL
I
CL
= -18mA -0.9 -1.5 V
LVDS OUTPUTS (TxOUT_, TxCLK OUT)
Differential Output Voltage V
OD
Figure 1 250 350 450 mV
Change in V
OD
Between
Complementary Output States
∆V
OD
Figure 1 2 25 mV
Output Offset Voltage V
OS
Figure 1 1.125 1.25 1.375 V
Change in V
OS
Between
Complementary Output States
∆V
OS
Figure 1 10 30 mV
V
OUT+
or V
OUT-
= 0V or V
CC,
non-DC-balanced mode
-10 ±5.7 +10
Output Short-Circuit Current I
OS
V
OUT+
or V
OUT-
= 0V or V
CC
,
DC-balanced mode
-15 ±8.2 +15
mA
V
OD
= 0V, non-DC-balanced mode
(Note 3)
5.7 10
Magnitude of Differential Output
Short-Circuit Current
I
OSD
V
OD
= 0V, DC-balanced mode (Note 3) 8.2 15
mA
78 110 147
DC-balanced mode
-40°C to +105°C 78 110 150
292 410 547
Differential Output Resistance R
O
Non-DC-balanced
mode
-40°C to +105°C 292 410 564
Ω