Datasheet
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profiles, as well as the latest information
on reliability testing results, go to Application Note 1891:
Wafer-Level Packaging (WLP) and its Applications.
Figure 4. Zero-Crossing Detector
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
6 UCSP B6+1 21-0097
Refer to
Application
Note 1891
MAX9028
IN-
2MΩ
2MΩ
R
PULLUP
3V (5V)
LOGIC OUT
OUT
V
CC
+5V (+3V)
+3V (+5V)
V
EE
5V (3V) LOGIC IN
IN+
LOGIC-LEVEL
TRANSLATOR
MAX9027
IN+
OUT
V
CC
100mV
P-P
V
CC
V
EE
IN-
Chip Information
PROCESS: BiCMOS
Typical Application Circuit
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
MAX9025–MAX9028 UCSP, 1.8V, Nanopower, Beyond-the-Rails
Comparators With/Without Reference
www.maximintegrated.com
Maxim Integrated
│
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