Datasheet

33Maxim Integrated
1.2A Switch-Mode Li+ Chargers with ±22V Input
Rating and JEITA Battery Temperature Monitoring
MAX8900A/MAX8900B/MAX8900C
Figure 15. Recommended Land Pattern
Figure 16. Bump Cross Section and Copper Pillar Detail
Chip Information
PROCESS: BiCMOS
Ordering Information (continued)
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
TOP VIEW SCALE DRAWING
5x6 BUMP ARRAY (30 BUMPS)
654321
A
B
C
D
E
180µm (min)
210µm (max)
B: PAD PITCH: 400µm
C: HEIGHT: 1.6mm
D: WIDTH: 2.0mm
A
D
A
B
B
C
A: FINISHED PAD DIAMETER:
E: BUMP DIAMETER: 260µm
F: COPPER PILLAR (UBM) WIDTH: 210µm
G: COPPER PILLAR PITCH: 400µm
COPPER PILLAR (UBM)
WAFER
EPOXY
EPOXY EPOXYEPOXY
E
F
G
PCB
COPPER PILLAR (UBM)
1oz COPPPER PAD 1oz COPPPER PAD
PART
TEMP
RANGE
PIN-
PACKAGE
OPTIONS
MAX8900CEWV+T
-40NC to
+85NC
30 WLP
V
OVLO
= 6.5V
T1 = 0NC
3-pin status indicators
V
PQUTH
= 3.0V