Datasheet

MAX7370
8 x 8 Key-Switch Controller and LED Driver/GPIOs
with I2C Interface and High Level of ESD Protection
36Maxim Integrated
Ordering Information
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed. pad.
**Future product—contact factory for availability.
Chip Information
PROCESS: BiCMOS
Wafer-Level Packaging (WLP)
Applications Information
For the latest application details on WLP construction,
dimensions, tape-carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reli-
ability testing results, refer to Application Note 1891:
Wafer-Level Packaging (WLP) and Its Applications,
available at www.maximintegrated.com.
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PART TEMP RANGE PIN-PACKAGE
MAX7370ETG+
-40NC to +85NC
24 TQFN-EP*
MAX7370EWA+**
-40NC to +85NC
25 WLP
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TQFN-EP T243A3+1
21-0188 90-0122
25 WLP W252F2+1
21-0453
Refer to
Application
Note 1891