Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
16 QSOP E16+4 21-0055 90-0167
16 TQFN-EP T1633+4 21-0136 90-0031
MAX7322
I2
O7
O6
I5
I4
V+
3.3V
µC
SCL
SDA
SCL
AD0
O1
O0
SDA
I3
GND
INPUT
INPUT
AD2
INT
OUTPUT
OUTPUT
OUTPUT
OUTPUT
INPUT
INPUT
RST
INT
RST
0.047F
TOP VIEW
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
AD0
V+
SDA
SCL
INT
O7
O6
I5
I4
MAX7322
QSOP
+
RST
AD2
I2
O0
O1
I3
GND
I
2
C
CONTROL
O7
I4
I5
O6
I3
I2
O1
O0
INT
I/O
PORTS
POWER-
ON RESET
INPUT
FILTER
RST
SDA
SCL
AD2
AD0
MAX7322
www.maximintegrated.com
Maxim Integrated │ 15
MAX7322 I
2
C Port Expander with
4 Push-Pull Outputs and 4 Inputs
Chip Information
PROCESS: BiCMOS
Typical Application Circuit
Pin Congurations (continued)
Functional Diagram
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.