Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
28 SSOP A28+1 21-0056 90-0095
28 TQFN-EP T2855+6 21-0140 90-0026
36 SSOP A36+4 21-0040 90-0098
40 TQFN-EP T4066+5 21-0141 90-0055
www.maximintegrated.com
Maxim Integrated │ 19
MAX7300 2-Wire-Interfaced, 2.5V to 5.5V,
20-Port or 28-Port I/O Expander
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: CMOS