Datasheet

µDFN
Junction-to-Ambient Thermal Resistance (θ
JA
)......... 477°C/W
Junction-to-Case Thermal Resistance (θ
JC
)................122C/W
Thin SOT23
Junction-to-Ambient Thermal Resistance (θ
JA
)..........110°C/W
Junction-to-Case Thermal Resistance (θ
JC
).................50°C/W
V
CC
, ENABLE, ENABLE, IN ...................................-0.3V to +6V
OUT, OUT (push-pull) ............................... -0.3V to (V
CC
+ 0.3V)
OUT, OUT (open-drain) .........................................-0.3V to +30V
CDELAY ................................................... -0.3V to (V
CC
+ 0.3V)
Output Current (all pins) ................................................... ±20mA
Continuous Power Dissipation (T
A
= +70°C)
6-Pin µDFN (derate 2.1mW/°C above +70°C) .........167.7mW
6-Pin Thin SOT23 (derate 9.1mW/°C above +70°C) ....727.3mW
Operating Temperature Range ......................... -40°C to +125°C
Storage Temperature Range ............................ -65°C to +150°C
Junction Temperature ...................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
(V
CC
= 1.5V to 5.5V, T
A
= -40°C to +125°C, unless otherwise specified. Typical values are at V
CC
= 3.3V and T
A
= +25°C, unless
otherwise noted.) (Note 2)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four layer
board. For detailed information on package thermal considerations refer to www.maximintegrated.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SUPPLY
Operating Voltage Range V
CC
1.5 5.5 V
Undervoltage Lockout (Note 3) UVLO V
CC
falling 1.20 1.35 V
V
CC
Supply Current I
CC
V
CC
= 3.3V, no load 10 20 µA
IN
Threshold Voltage V
TH
V
IN
rising, 1.5V < V
CC
< 5.5V 0.491 0.5 0.509 V
Hysteresis V
HYST
V
IN
falling 5 mV
Input Current (Note 4) I
IN
V
IN
= 0V or V
CC
-15 +15 nA
CDELAY
Delay Charge Current I
CD
200 250 300 nA
Delay Threshold V
TCD
CDELAY rising 0.95 1.00 1.05 V
CDELAY Pulldown Resistance R
CDELAY
130 500 Ω
ENABLE/ENABLE
Input Low Voltage V
IL
0.4 V
Input High Voltage V
IH
1.4 V
Input Leakage Current I
LEAK
ENABLE, ENABLE = V
CC
or GND -100 +100 nA
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Maxim Integrated │ 2
MAX6895–MAX6899 Ultra-Small, Adjustable Sequencing/
Supervisory Circuits
Electrical Characteristics
Package Thermal Characteristics (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings