Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE NO.
LAND
PATTERN NO.
6 µDFN L611+1
21-0147 90-0080
6 Thin SOT23 Z6+1 21-0114 90-0242
1 2 3
6 5 4
OUTV
CC
CDELAY
ENABLE INGND
MAX6896
MAX6898
µDFN
TOP VIEW
THIN SOT23
TOP VIEW
MAX6895
MAX6897
IN
1
2GND
ENABLE
+
+
3 OUT
6
5
CDELAY
V
CC
4
THIN SOT23
TOP VIEW
MAX6896
MAX6898
MAX6899
IN
1
2GND
ENABLE
3 OUT
(OUT)
( ) FOR MAX6899 ONLY.
6
5
CDELAY
V
CC
4
www.maximintegrated.com
Maxim Integrated
14
MAX6895–MAX6899 Ultra-Small, Adjustable Sequencing/
Supervisory Circuits
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Pin Congurations (continued)