Datasheet

MAX6730–MAX6735
Single-/Dual-/Triple-Voltage µP Supervisory
Circuits with Independent Watchdog Output
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
1 = V
CC
2 = +0.8V to +5.5V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage V
CC
1, V
CC
2 0.8 5.5 V
V
CC
1 < +5.5V, all I/O connections
open, outputs not asserted
15 39
I
CC
1
V
CC
1 < +3.6V, all I/O connections
open, outputs not asserted
10 28
V
CC
2 < +3.6V, all I/O connections
open, outputs not asserted
4 11
Supply Current
I
CC
2
V
CC
2 < +2.75V, all I/O connections
open, outputs not asserted
3 9
μA
L (falling) 4.500 4.625 4.750
M (falling) 4.250 4.375 4.500
T (falling) 3.000 3.075 3.150
S (falling) 2.850 2.925 3.000
R (falling) 2.550 2.625 2.700
Z (falling) 2.250 2.313 2.375
Y (falling) 2.125 2.188 2.250
W (falling) 1.620 1.665 1.710
V
CC
1 Reset Threshold V
TH
1
V (falling) 1.530 1.575 1.620
V
V
CC
1, V
CC
2, RSTIN, MR, WDI to GND.....................-0.3V to +6V
RST, WDO to GND (open drain)...............................-0.3V to +6V
RST, WDO to GND (push-pull) .................-0.3V to (V
CC
1 + 0.3V)
Input Current/Output Current (all pins) ...............................20mA
Continuous Power Dissipation (T
A
= +70°C)
6-Pin SOT23-6 (derate 4.3mW/°C above +70°C) .....347.8mW
8-Pin SOT23-8 (derate 5.6mW/°C above +70°C) .....444.4mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
Lead (Pb)-free packages.............................................+260°C
Package containing lead (Pb) .....................................+240°C
6 SOT23
Junction-to-Ambient Thermal Resistance (θ
JA
).......…230°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..............…76°C/W
8 SOT23
Junction-to-Ambient Thermal Resistance (θ
JA
).......…180°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..............…60°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.