Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 SOT23 K8FH#4 21-0078 90-0176
8 TDFN-EP T833+2 21-0137 90-0059
SCKV
CC
1
2
8
7
N.C.
SDODXN
DXP
GND
SOT23
TOP VIEW
3
4
6
5
MAX6627
CS
1
+
3 4
8 6 5
N.C. CS SCK
MAX6627
MAX6628
2
7
SDO
GND DXP
EP
V
CC
DXN
TDFN
DXP
DXN
12-BIT + SIGN
ADC
V
CC
SPI
INTERFACE
SDO
SCK
CS
MAX6627/MAX6628 Remote ±1ºC Accurate Digital Temperature
Sensors with SPI-Compatible Serial Interface
www.maximintegrated.com
Maxim Integrated │ 8
Chip Information
PROCESS: BiCMOS
Pin Congurations
Functional Diagram
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.