Datasheet

Figure 3. +5V and -5V References from a Single +5V Supply
+Denotes a lead(Pb)-free/RoHS-compliant package.
PART TEMP RANGE
PIN-
PACKAGE
MAX
TEMPCO
(ppm/°C)
MAX6241ACPA+ 0°C to +70°C 8 Plastic DIP 2.0
MAX6241BCPA+ 0°C to +70°C 8 Plastic DIP 5.0
MAX6241ACSA+ 0°C to +70°C 8 SO 2.0
MAX6241BCSA+ 0°C to +70°C 8 SO 5.0
MAX6241AEPA+ -40°C to +85°C 8 Plastic DIP 3.0
MAX6241BEPA+ -40°C to +85°C 8 Plastic DIP 7.0
MAX6241AESA+ -40°C to +85°C 8 SO 3.0
MAX6241BESA+ -40°C to +85°C 8 SO 7.0
MAX6241AMJA -55°C to 125°C 8 CERDIP 5.0
MAX6241BMJA -55°C to +125°C 8 CERDIP 8.0
MAX6250ACPA+ 0°C to +70°C 8 Plastic DIP 2.0
MAX6250BCPA+ 0°C to +70°C 8 Plastic DIP 5.0
MAX6250ACSA+ 0°C to +70°C 8 SO 2.0
MAX6250BCSA+ 0°C to +70°C 8 SO 5.0
MAX6250AEPA+ -40°C to +85°C 8 Plastic DIP 3.0
MAX6250BEPA+ -40°C to +85°C 8 Plastic DIP 7.0
MAX6250AESA+ -40°C to +85°C 8 SO 3.0
MAX6250BESA+ -40°C to +85°C 8 SO 7.0
MAX6250AMJA -55°C to +125°C 8 CERDIP 5.0
MAX6250BMJA -55°C to +125°C 8 CERDIP 8.0
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 SO S8+5 21-0041 90-0096
8 PDIP P8+3 21-0043 –
8 CERDIP J8-2 21-0045 –
IN
V
CC
V+
V-
GND
C2-
C2+
C1-
C1+
+5V INPUT
+REFERENCE OUT
-REFERENCE OUT
OUT
TRIM
R1
10kΩ
R4
100kΩ
R2
100kΩ
R3
1kΩ
NR
C1
2.2µF
3.3µF
3.3µF
2.2µF
C2
1µF
2.2µF
C3
1µF
C4
GND
MAX865
MAX6250
MAX432
MAX6225/MAX6241/MAX6250 Low-Noise, Precision,
+2.5V/+4.096V/+5V Voltage References
www.maximintegrated.com
Maxim Integrated │ 10
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: CMOS
Ordering Information (continued)