Datasheet

20Maxim Integrated
MAX5988A/MAX5988B
IEEE 802.3af-Compliant, High-Efficiency, Class 1/Class 2,
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Ordering Information/Selector Guide
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TQFN-EP T2044+4
21-0139 90-0409
PART PIN-PACKAGE
SLEEP/ULP
MODE
LDO UVLO (V) RESET MPS/CLASS2
OUTPUT
ADJ
(V)
MAX5988AETP+ 20 TQFN-EP* Yes Yes 38.8 Yes Yes 3 to 5.6
MAX5988BETP+ 20 TQFN-EP* Yes Yes 38.8 Yes Yes 5.4 to 14