Datasheet

IEEE 802.3af/at-Compliant, Powered Device Interface
Controllers with Integrated 70W High-Power MOSFET
MAX5982A/MAX5982B/MAX5982C
16 _____________________________________________________________________________________
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: BiCMOS
Ordering Information
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 TQFN-EP T1655+4
21-0140 90-0121
PART TEMP RANGE PIN-PACKAGE
SLEEP/ULTRA-LOW-
POWER MODE
6s FILTER DELAY ON SL
MAX5982AETE+
-40NC to +85NC
16 TQFN-EP* Yes Yes
MAX5982BETE+
-40NC to +85NC
16 TQFN-EP* Yes No
MAX5982CETE+
-40NC to +85NC
16 TQFN-EP* No ––