Datasheet

2 Maxim Integrated
Active-Clamped, Spread-Spectrum,
Current-Mode PWM Controllers
MAX5974A/MAX5974B/MAX5974C/MAX5974D
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
IN to GND (V
EN
= 0V) ...........................................-0.3V to +26V
EN, NDRV, AUXDRV to GND .....................-0.3V to (V
IN
+ 0.3V)
RT, DT, FFB, COMP, SS, DCLMP, DITHER/SYNC
to GND .................................................................-0.3V to +6V
FB to GND (MAX5974A/MAX5974B only) .................. -6V to +6V
FB to GND (MAX5974C/MAX5974D only) ..............-0.3V to +6V
CS, CSSC to GND ................................................... -0.8V to +6V
PGND to GND ......................................................-0.3V to +0.3V
Maximum Input/Output Current (continuous)
IN, NDRV, AUXDRV ......................................................100mA
NDRV, AUXDRV (pulsed for less than 100ns) .................. Q1A
Continuous Power Dissipation (T
A
= +70NC) (Note 1)
16-Pin TQFN (derate 20.8mW/NC above +70NC) ....... 1666mW
Operating Temperature Range .......................... -40NC to +85NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
IN
= 12V (for MAX5974A/MAX5974C, bring V
IN
up to 17V for startup), V
CS
= V
CSSC
= V
DITHER/SYNC
= V
FB
= V
FFB
= V
DCLMP
=
V
GND
, V
EN
= +2V, NDRV = AUXDRV = SS = COMP = unconnected, R
RT
= 34.8kI, R
DT
= 25kI, C
IN
= 1FF, T
A
= -40NC to +85NC,
unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Junction-to-Ambient Thermal Resistance (B
JA
) ..............48NC/W
Junction-to-Case Thermal Resistance (B
JC
) .....................7NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
UNDERVOLTAGE LOCKOUT/STARTUP (IN)
Bootstrap UVLO Wakeup Level V
INUVR
V
IN
rising
MAX5974A/C 15.4 16 16.5
V
MAX5974B/D
-40°C to
+85°C
8 8.4 8.85
-40°C to
+125°C
7.95 8.4 8.85
Bootstrap UVLO Shutdown
Level
V
INUVF
V
IN
falling
-40°C to +85°C 6.65 7 7.35
V
-40°C to +125°C 6.6 7 7.35
IN Clamp Voltage V
IN_CLAMP
I
IN
= 2mA (sinking) 17 18.5 20 V
IN Supply Current in
Undervoltage Lockout
I
START
V
IN
= +15V (for
MAX5974A/C);
V
IN
= +7.5V (for
MAX5974B/D),
when in
bootstrap UVLO
-40°C to +85°C 100 150
FA
-40°C to +125°C 100 250
IN Supply Current After Startup I
C
V
IN
= +12V
-40°C to +85°C 1.8 3
mA
-40°C to +125°C 1.8 4