Datasheet

ManualsBrandsMAXIM INTEGRATED ManualsData collecting ICsData acquisition IC - DA converter (DAC) TSSOP 24

MAX5590–MAX5595

Buffered, Fast-Settling, Octal, 12/10/8-Bit,

Voltage-Output DACs

______________________________________________________________________________________ 31

Power-Supply and Layout Considerations

Bypass the analog and digital power supplies by using a

10µF capacitor in parallel with a 0.1µF capacitor to AGND

and DGND (Figure 10). Minimize lead lengths to reduce

lead inductance. Use shielding and/or ferrite beads to fur-

ther increase isolation.

Digital and AC transient signals coupling to AGND can

create noise at the output. Connect AGND to the high-

est quality ground available. Use proper grounding

techniques, such as a multilayer board with a low-

inductance ground plane. Wire-wrapped boards and

sockets are not recommended. For optimum system

performance, use PC boards with separate analog and

digital ground planes. Connect the two ground planes

together at the low-impedance power-supply source.

Using separate power supplies for AV

and DV

improves noise immunity. Connect AGND and DGND at

the low-impedance power-supply sources (Figure 11).

MAX5590–MAX5595

REF

10µF*

0.1µF*

REF

SCLK

DIN

UPIO1

UPIO2

DSP

AGND** DGND**

OUTA

FBA

FBH

OUTH

MAX5591

MAX5593

MAX5595

ONLY

10µF0.1µF10µF0.1µF

*REMOVE BYPASS CAPACITORS ON REF FOR AC-REFERENCE INPUTS.

**CONNECT ANALOG AND DIGITAL GROUND PLANES AT THE

LOW-IMPEDANCE POWER-SUPPLY SOURCE.

Figure 10. Bypassing Power Supplies AV

, DV

, and REF

MAX5590–MAX5595

0.1µF

10µF

AGND

0.1µF

10µF

DGND

ANALOG SUPPLY DIGITAL SUPPLY

DIGITAL

CIRCUITRY

Figure 11. Separate Analog and Digital Power Supplies