Datasheet

PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
24 TSSOP U24+1 21-0066 90-0118
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
GND
MODEIND
LEDIND4
LEDIND3MUTE
UP/BALL
DN/BALR
V
LOGIC
TOP VIEW
LEDIND2
LEDIND1
LEDIND0
HLHR
N.C.
SHDN
MODE
16
15
14
13
9
10
11
12
LL
WL
V
SS
V
DD
BIASCAP
BIAS
WR
LR
TSSOP
MAX5486
+
MAX5486 Stereo Volume Control with Pushbutton
Interface
www.maximintegrated.com
Maxim Integrated │ 15
Functional Diagram Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character,
but the drawing pertains to the package regardless of RoHS
status.