Datasheet

40Maxim Integrated
MAX5318
18-Bit, High-Accuracy Voltage Output DAC with
Digital Gain, Offset Control, and SPI Interface
Typical Operating Circuit
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
+Denotes a lead(Pb)-free/RoHS-compliant package.
Ordering Information
2.4V TO (V
AVDD
- 0.1V)
MBR0530T1G
V
DDIO
2.0kI
24
REF
0.1µF 0.01µF
18
µC
GPIO’s
SPI
INTERFACE
0.1µF1µF 10µF
2.7V TO 5V
1.8V TO 5V
AVDD2
21
AVDD1
14
17 REFO
15 OUT
16 RFB
BYPASS
22
LINEAR
REGULATOR
MAX5318
23
DGND
13
AGND
19
AGND_S
20
AGND_F
12
AVSS
BUFFER
OUTPUT
BUFFER
0 TO -1.25V
4
BUSY
3
M/Z
10
TS/SB
11
PD
1
RST
5
LDAC
2
READY
9
CS
8
SCLK
7
DIN
6
DOUT
0.1µF
0.1µF
10µF
100pF
R
L
INTERFACE
AND
CONTROL
DAC
REGISTER
DIGITAL GAIN
AND OFFSET
18-BIT
DAC
INPUT
REGISTER
PART TEMP RANGE PIN-PACKAGE
MAX5318GUG+
-40NC to +105NC
24 TSSOP
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
24 TSSOP U24+1
21-0066 90-0118