Datasheet

capacitor in parallel with a 0.1µF capacitor to GND.
Minimize lead lengths to reduce lead inductance.
Grounding and Layout Considerations
Digital and AC transient signals on GND can create
noise at the output. Connect GND to the highest quality
ground available. Use proper grounding techniques,
such as a multilayer board with a low-inductance
ground plane or star connect all ground return paths
back to the MAX5234/MAX5235 GND. Carefully lay out
the traces between channels to reduce AC cross-cou-
pling and crosstalk. Wire-wrapped boards and sockets
are not recommended. If noise becomes an issue,
shielding may be required.
Chip Information
TRANSISTOR COUNT: 4184
PROCESS: BiCMOS
MAX5234/MAX5235
Single-Supply 3V/5V, Voltage-Output, Dual,
Precision 12-Bit DACs
______________________________________________________________________________________ 17
V
OUT
GND
MAX5234
MAX5235
R2
R1
R3
DAC A
DAC
REG A
INPUT
REG A
DAC B
DAC
REG B
INPUT
REG B
SHIFT
REGISTER
R4
OUTA
121kΩ
77.25kΩ
OUTB
121kΩ
VOUT = (GAIN) (OFFSET)
NA IS THE NUMERIC VALUE OF THE INPUT CODE FOR DAC A.
NB IS THE NUMERIC VALUE OF THE INPUT CODE FOR DAC B.
77.25kΩ
REFA
SCLK
DIN
REFB
CS
V
IN
V
REF
V
DD
=
V
IN
2NA
4096
1 +
R4
R3
R2
R1 + R2
R4
R3
V
REF
2NB
4096
–
Figure 11. Digital Control of Gain and Offset
TO OTHER
SERIAL DEVICES
MAX5234
MAX5235
DIN
SCLK
CS
MAX5234
MAX5235
DIN
SCLK
CS
MAX5234
MAX5235
DIN
SCLK
CS
DIN
SCLK
CS1
CS2
CS3
Figure 12. Multiple MAX5234/MAX5235 Sharing a Common DIN Line