Datasheet

Pin-/Software-Compatible,
16-/12-Bit, Voltage-Output DACs
2 Maxim Integrated
MAX5134–MAX5137
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
AVDD
= 2.7V to 5.25V, V
DVDD
= 2.7V to 5.25V, V
AVDD
≥ V
DVDD
, V
GND
= 0V, V
REFI
= V
AVDD
- 0.25V, C
OUT
= 200pF, R
OUT
= 10kΩ,
T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to GND...........................................................-0.3V to +6V
DVDD to GND...........................................................-0.3V to +6V
OUT0–OUT3 to GND ....................................-0.3V to the lower of
(AVDD + 0.3V) and +6V
REFI, REFO, M/Z to GND .............................-0.3V to the lower of
(AVDD + 0.3V) and +6V
SCLK, DIN, CS to GND ................................-0.3V to the lower of
(DVDD + 0.3V) and +6V
LDAC, READY to GND .................................-0.3V to the lower of
(DVDD + 0.3V) and +6V
Continuous Power Dissipation (T
A
= +70°C)
24-Pin TQFN (derate at 27.8mW/°C above +70°C)....2222.2mW
16-Pin TSSOP (derate at 11.1mW/°C above +70°C)....888.9mW
Maximum Current into Any Input or Output
with the Exception of M/Z Pin .......................................±50mA
Maximum Current into M/Z Pin ...........................................±5mA
Operating Temperature Range .........................-40°C to +105°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
STATIC ACCURACY (Notes 1, 2)
MAX5134/MAX5136 16
Resolution N
MAX5135/MAX5137 12
Bits
(Note 3) -8 ±2 +10
Integral Nonlinearity
(MAX5134/MAX5136)
INL
V
REFI
= 5V,
V
AVDD
= 5.25V
T
A
= +25°C ±6
LSB
Integral Nonlinearity
(MAX5135/MAX5137)
INL V
REFI
= 5V, V
AVDD
= 5.25V -1 +0.25 +1 LSB
Differential Nonlinearity DNL Guaranteed monotonic -1.0 +1.0 LSB
Offset Error OE (Note 4) -10 ±1 +10 mV
Offset-Error Drift ±4 μV/°C
Gain Error GE (Note 4) -0.5 ±0.2 +0.5 % of FS
Gain Temperature Coefficient ±2
ppm
FS/°C
REFERENCE INPUT
V
AVDD
= 3V to 5.25V 2 V
AVDD
Reference-Input Voltage Range V
REFI
V
AVDD
= 2.7V to 3V 2
V
AVDD
- 0.2
V
Reference-Input Impedance 113 k
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ............36°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...................3°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ............90°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .................27°C/W