Datasheet

(All voltages referenced to PGND, unless otherwise noted.)
IN (transient, 1ms) ................................................. -0.3V to +45V
SGND ...................................................................-0.3V to +0.3V
LX ..................................................................-1V to (V
IN
+ 0.3V)
LX Current ...............................................................................2A
EN...............................................................-0.3V to (V
IN
+ 0.3V)
BP, SYNC, LDO/BUCK, RESET to SGND ............-0.3V to +12V
BP, RESET Output Current ................................................25mA
CT, SS, ADJ, COMP to SGND ..................-0.3V to (V
BP
+ 0.3V)
OUT ....................................................................... -0.3V to +11V
OUT Short-Circuit Duration .......................................Continuous
Continuous Power Dissipation (T
A
= +70°C)*
16-Pin TQFN (derate 33.3mW/°C above +70°C) .....2666mW
20-Pin TSSOP (derate 21.7mW/°C above +70°C) ... 1739mW
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) ................................. +300°C
*As per JEDEC 51 Standard—Multilayer Board.
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) .........30.0°C/W Junction-to-Case Thermal Resistance (θ
JC
) ..................1.7°C/W
Package Thermal Characteristics (Note 1)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) .........46.0°C/W Junction-to-Case Thermal Resistance (θ
JC
) .....................2°C/W
(V
IN
= +14V, I
OUT
= 1mA, C
IN
= 100μF, C
OUT
= 22μF, L = 22μH, C
BP
= 1μF, V
EN
= +2.4V (Figure 2), SGND = PGND = 0V, T
A
= T
J
=
-40°C to +125°C, unless otherwise noted. Typical values are at T
A
= T
J
= +25°C.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SYSTEM INPUT
Input Voltage Range (LDO Mode) V
IN_LDO
LDO/BUCK = high 4 40 V
Input Voltage Range
(Buck Mode)
V
IN_BUCK
LDO/BUCK = low 5 40 V
Internal Input Undervoltage
Lockout
V
UVLO
V
BP
rising 3.5 3.65 3.9 V
Internal Input Undervoltage-
Lockout Hysteresis
V
UVLO_HYS
V
BP
rising 0.2 V
BP (Internal Regulator) Output
Voltage
V
BP
V
IN
= +4.5V, I
BP
= 100μA 3.75 4 4.20 V
Quiescent Supply Current
(LDO Mode)
I
Q
LDO/BUCK = high,
measured at input supply
return, V
OUT
= 5V,
I
OUT
= 100μA
T
A
= -40°C
to +125°C
38 70
µA
I
Q
LDO/BUCK = high,
measured at input supply
return, V
OUT
= 5V,
I
OUT
= 100mA
T
A
= -40°C
to +125°C
44 100
Buck Converter No-Load Supply
Current
I
Q_BUCK
V
IN
= 14V, V
OUT
= 5V, I
OUT
= 0 680 µA
Shutdown Supply Current I
SHDN
V
EN
= 0V, measured from
V
IN
T
A
= -40°C to
+125°C
6 19
µA
T
A
= -40°C to
+125°C
6 12
MAX5096/MAX5097 40V, 600mA Buck Converters with Low-
Quiescent-Current Linear Regulator Mode
www.maximintegrated.com
Maxim Integrated │ 2
Absolute Maximum Ratings
Electrical Characteristics