Datasheet

3) Connect the exposed pad of the IC to the SGND
plane. Do not make a direct connection between the
exposed pad plane and SGND (pin 2) under the IC.
Connect the exposed pad and pin 2 to the SGND
plane separately. Connect the ground connection of
the feedback resistive divider, the soft-start capacitor,
the adjustable reset timeout capacitor, and the com-
pensation network to the SGND plane. Connect the
SGND plane and PGND plane at one point near the
input bypass capacitor at V
IN
.
4) Use the large SGND plane as a heatsink for the
MAX5096/MAX5097. Use large PGND and LX planes
as heatsinks for the rectifier diode and the inductor.
PART
OUTPUT
VOLTAGE
(V)
SWITCHING
FREQUENCY
(kHz)
MAX5096A_ _ _ +3.3/Adjustable 135
MAX5096B_ _ _ +5.0/Adjustable 135
MAX5097A_ _ _ +3.3/Adjustable 330
MAX5097B_ _ _ +5.0/Adjustable 330
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
16 TQFN T1655+2 21-0140 90-0072
20 TSSOP U20E+4 21-0108 90-0115
MAX5096/MAX5097 40V, 600mA Buck Converters with Low-
Quiescent-Current Linear Regulator Mode
www.maximintegrated.com
Maxim Integrated │ 17
Selector Guide
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.