Datasheet
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 TDFN-EP T833+2 21-0137 90-0059
8 SO-EP S8E+14 21-0111 90-0151
RES
GNDCT
1
+
2
8
7
V
OUT
SOSI
EN
V
S
SO-EP
TOP VIEW
3
4
6
5
EXPOSED PADDLE
MAX5091
MAX5091 28V, 100mA, Low-Quiescent-Current LDO
with Reset and Power-Fail Input/Output
www.maximintegrated.com
Maxim Integrated
│
12
Pin Congurations (continued) Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character,
but the drawing pertains to the package regardless of RoHS
status.