Datasheet

MAX5054–MAX5057
Exposed Pad
Both the SO-EP and TDFN-EP packages have an
exposed pad on the bottom of their package. These
pads are internally connected to GND. For the best
thermal conductivity, solder the exposed pad to the
ground plane to dissipate 1.5W and 1.9W in SO-EP and
TDFN-EP packages, respectively. Do not use the
ground-connected pads as the only electrical ground
connection or ground return. Use GND (pin 3) as the
primary electrical ground connection.
4A, 20ns, Dual MOSFET Drivers
12 ______________________________________________________________________________________
Additional Application Circuits
MAX5054
INA+
INA-
INB+
INB-
OUTB
OUTA
V
DD
GND
V
DD
PWM IN
PWM IN
MAX5054
INA+
INA-
INB+
INB-
OUTB
OUTA
V
DD
GND
PWM IN
V
OUT
V
IN
Figure 5. Push-Pull Converter with Synchronous Rectification Drive Using MAX5054