Datasheet

MAX4999
USB 2.0 Hi-Speed Differential
8:1 Multiplexer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
CC
...........................................................................-0.3V to +4V
All Other Pins (Note 1)..............................................-0.3V to +4V
Continuous Current (COM_ to any switch) .......................±60mA
Peak Current (COM_ to any switch) (pulsed at 1ms,
10% duty cycle)..........................................................±120mA
Continuous Power Dissipation (T
A
= +70°C)
32-Lead TQFN (derate 34.5mW/°C above +70°C) ....2759mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ............29°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............2.0°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage V
CC
3.0 3.6 V
Charge pump on 5
Quiescent Supply Current I
O
Charge pump off 1
µA
ANALOG SWITCH
On-Resistance R
ON
I
COM_
= ±10mA 6.5 12 Ω
On-Resistance Match ∆R
ONSC
V
COM_
= 1V, T
A
= +25°C 0.8 Ω
On-Resistance Match Between
Channels
∆R
ONBC
V
COM_
= 1V, T
A
= +25°C 1 Ω
Leakage Current COM_, D_ _0,
D_ _1
I
L
V
CC
= +3.6V -1 +1 µA
SWITCH AC PERFORMANCE (Note 4)
Crosstalk V
DCT1
Any switch to non-paired switch at 500MHz
(Figure 3)
-30 dB
Off-Isolation V
OFF
Any switch to non-paired switch at 240MHz
(Figure 3)
-27 dB
Bandwidth -3dB BW R
L
= 45Ω unbalanced (Figure 3) 1200 MHz
f = 1MHz 6
On-Capacitance C
ON
Taken from S11 parameters at f = 240MHz 3.0
pF
f = 1MHz, COM_ 5
Off-Capacitance C
OFF
Taken from S11 parameters at f = 240MHz 3.0
pF
Propagation Delay t
PD
R
L
= R
S
= 50Ω (Figure 2) 300 ps
Turn-On Time t
ON
V
D_ _0
or V
D_ _1
= +1.5V, R
L
= 300Ω,
C
L
= 35pF, V
IH
= V
CC
, V
IL
= 0V (Figure 1)
10 µs
Note 1: Signals exceeding GND are clamped by internal diodes. Limit forward-diode current to maximum current rating.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.