Datasheet
MAX4968/MAX4968A
16-Channel, Linear, High-Voltage
Analog Switches
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V
DD
Logic Supply Voltage Range ..........................-0.3V to +6V
V
PP
- V
NN
Supply Voltage ................................................ +172V
V
PP
Supply Voltage Range ...................................-0.3V to +12V
V
NN
Negative Supply Voltage ............................................-160V
Logic Input Voltage Range (CLK, DIN, CLR) .........-0.3V to +6V
Logic Input Voltage Range
(LE) ........................-0.3V to a minimum of (V
PP
+ 0.3V) or 6V
Logic Output Voltage Range (DOUT) ...... -0.3V to (V
DD
+ 0.3V)
Analog Signal Range (SW_) ........ (V
NN
- 0.3V) to (V
NN
+ 220V)
Continuous Power Dissipation (T
A
= +70NC)
LQFP (derate 22.7mW/NC above +70NC) .................1818mW
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature ................................................... +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V
DD
= +2.37V to +5.5V, V
PP
= +10V Q5%, V
NN
= 0 to -160V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are
V
DD
= +3.3V, V
NN
= -100V, V
PP
= +10V at T
A
= +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
LQFP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........44°C/W
Junction-to-Case Thermal Resistance (q
JC
) ...............10°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLIES
V
DD
Logic Supply Voltage V
DD
+2.37 +5.5 V
V
NN
Supply Voltage V
NN
-160 0 V
V
PP
Supply Voltage V
PP
+9.5 +10 +10.5 V
V
DD
Static Current I
DDS
4
FA
V
DD
Dynamic Current I
DD
V
DD
= +5V, f
CLK
= 5MHz, f
DIN
= 2.5MHz 200
FA
V
NN
Static Current I
NNS
All switches remain on or off, SW_ = GND 10 20
FA
V
NN
Supply Dynamic Current
(All Channels Switching
Simultaneously)
I
NN
V
PP
= +10V, V
NN
= -100V,
f
TURN_ON/OFF
= 50kHz, SW_ = GND
3.3 5 mA
V
PP
Supply Static Current I
PPS
All switches remain on or off, SW_ = GND 12 25
FA
V
PP
Supply Dynamic Current
(All Channels Switching
Simultaneously)
I
PP
V
PP
= +10V, V
NN
= -100V,
f
TURN_ON/OFF
= 50kHz, SW_ = GND
4 6 mA
SWITCH CHARACTERISTICS
Analog Dynamic Signal Range V
SW_
AC operation only, f > 500kHz V
NN
V
NN
+
210
V
Small-Signal On-Resistance R
ONS
V
PP
= +10V, V
NN
= -100V, V
SW_
= 0V,
I
SW_
= 5mA
18 34
I