Datasheet

Exposed-Pad Package
The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal-resistance path
for heat removal from the IC. The exposed pad on the
MAX4951 must be soldered to GND for proper thermal
and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application
Note HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages .
Layout
Use controlled-impedance transmission lines to inter-
face with the MAX4951 high-speed inputs and outputs.
Place power-supply decoupling capacitors as close as
possible to V
CC
.
ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX4951 is protected against ESD up
to ±5.5kV (Human Body Model) without damage. The
ESD structures withstand ±5.5kV in all states: normal
operation and powered down. After an ESD event, the
MAX4951 continues to function without latchup.
MAX4951
SATA I/SATA II Bidirectional Re-Driver
_______________________________________________________________________________________ 7
Functional Diagram/Truth Table
V
CC
V
CC
50
Ω
50
Ω
V
CC
50
Ω
50
Ω
V
CC
50
Ω
50
Ω
V
CC
50
Ω
50
Ω
CONTROL LOGIC
MAX4951
DAP
HAP
DAM
HAM
DBM
HBM
DBP
HBP
BB ENBA
GND
X = Don’t Care
MAX4951
EN BA BB CHANNEL A CHANNEL B
0 X X Standby Standby
1 0 0 Standard SATA Standard SATA
1 1 0 Boost Standard SATA
1 0 1 Standard SATA Boost
1 1 1 Boost Boost