Datasheet

SATA I/II Bidirectional Redriver
with High ESD and Cable Detect
9
MAX4951AE
Applications Information
Figure 4 shows a typical application circuit with the
MAX4951AE used to drive an eSATA output. The dia-
gram assumes that the MAX4951AE is close to the SATA
host controller. In this application, BB is set low to drive
standard SATA levels to the host, and BA is set high
to overcome board/connector losses, matching eSATA
levels at the connector. If the MAX4951AE is further from
the controller, set BB high to compensate for the added
attenuation. The MAX4951AE is backward-compatible
with the MAX4951 (see Figure 5).
Exposed-Pad Package
The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal resistance path
for heat removal from the IC. The exposed pad on the
MAX4951AE must be soldered to GND for proper ther-
mal and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application Note
862: HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages.
Layout
Use controlled-impedance transmission lines to interface
with the MAX4951AE high-speed inputs and outputs.
Place power-supply decoupling capacitors as close as
possible to the V
CC
pin.
Power Supply Sequencing
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings can
cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all devices. Always apply V
CC
before applying signals,
especially if the signal is not current limited.
Figure 4. Typical Application Circuit
EN
GPIO
+3.3V
0.001µF0.1µF
GNDBB
V
CC
BA
+3.3V
SATA HOST
CONTROLLER
eSATA
DEVICE
CONNECTOR
Rx
1
4
5
6
7 OR 1*
*PIN 1 AND 7 CAN BE INTERCHANGED DEPENDING ON THE LAYOUT.
2
3
Tx
10nF (X7R)
10nF (X7R)
10nF (X7R)
10nF (X7R)
10nF (X7R)
10nF (X7R)
10nF (X7R)
10nF (X7R)
HAP
HAM
HBM
HBP
DAP
DAM
DBM
DBP
CAD
Tx
Rx
MAX4951AE