Datasheet
SATA I/II Bidirectional Redriver
with High ESD and Cable Detect
2
MAX4951AE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages Referenced to GND.)
V
CC
...................................................................... -0.3V to +4.0V
HAP, HAM, DBP, DBM, EN,
CAD, BA, BB (Note 1) ......................... -0.3V to (V
CC
+ 0.3V)
Short-Circuit Output Current
(HBP, HBM, DAP, DAM) ............................................. Q30mA
Continuous Current at Inputs
(HAP, HAM, DBP, DBM) ............................................... Q5mA
Continuous Current
(EN, CAD, BA, BB) ........................................................ Q5mA
Continuous Power Dissipation (T
A
= +70NC)
20-Pin TQFN (derate 25.6mW/NC above +70NC) ..... 2051mW
Junction-to-Case Thermal Resistance (B
JC
) (Note 2)
20-Pin TQFN ................................................................ 6NC/W
Junction-to-Ambient Thermal Resistance (B
JA
) (Note 2)
20-Pin TQFN .............................................................. 39NC/W
Operating Temperature Range ........................... 0NC to +70NC
Storage Temperature Range ......................... -55NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, C
L
= 10nF, R
L
= 50I, T
A
= 0NC to +70NC, unless otherwise noted. Typical values are at V
CC
= +3.3V,
T
A
= +25NC.) (Note 3)
ABSOLUTE MAXIMUM RATINGS
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Power-Supply Range V
CC
3.0 3.6 V
Operating Supply Current I
CC
BA = BB = V
CC
75 100
mA
BA = BB = GND 70 90
Power-Down Supply Current I
PWDN
EN = GND or CAD = V
CC
0.35 2 mA
Differential Input Resistance Z
RX-DIFF-DC
85 100 115
I
Differential Output Resistance Z
TX-DIFF-DC
85 100 115
I
AC PERFORMANCE
Differential Input Return Loss
(Note 4)
RL
RX-DIFF
f = 150MHz to 300MHz -18
dB
f = 300MHz to 600MHz -14
f = 600MHz to 1200MHz -10
f = 1.2GHz to 2.4GHz -8
f = 2.4GHz to 3.0GHz -3
Common-Mode Input Return
Loss (Note 4)
RL
RX-CM
f = 150MHz to 300MHz -5
dB
f = 300MHz to 600MHz -5
f = 600MHz to 1200MHz -2
f = 1.2GHz to 2.4GHz -2
f = 2.4GHz to 3.0GHz -2
Differential Output Return Loss
(Note 4)
RL
TX-DIFF
f = 150MHz to 300MHz -14
dB
f = 300MHz to 600MHz -8
f = 600MHz to 1200MHz -6
f = 1.2GHz to 2.4GHz -6
f = 2.4GHz to 3.0GHz -3