Datasheet

MAX4950
Quad PCI Express Equalizer/Redriver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
V
CC
........................................................................-0.3V to +4.0V
All Other Pins (Note 1)................................-0.3V to (V
CC
+ 0.3V)
Continuous Current IN_P and IN_N..................................±30mA
Peak Current IN_P and IN_N (pulsed for 1µs,
1% duty cycle)............................................................±100mA
Continuous Power Dissipation (T
A
= +70°C)
42-Pin TQFN (derate 34.5mW/°C above +70°C) .......2759mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 2)
42-Pin TQFN................................................................2.0°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 2)
42-Pin TQFN..............................................................29.0°C/W
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, C
CL
= 75nF coupling capacitor on each output, R
L
= 50Ω resistor on each output, T
A
= 0°C to +70°C, unless
otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC PERFORMANCE
Power-Supply Range V
CC
3.0 3.6 V
EN = V
CC
262 328
Supply Current I
CC
O_AMP = GND,
P _S AV = G N D ( N ote 4)
EN = GND 100 125
mA
Differential Input Impedance Z
RX-DIFF-DC
DC 80 100 120 Ω
Differential Output
Impedance
Z
TX-DIFF-DC
DC 80 100 120 Ω
Common-Mode Resistance
to GND
Z
RX-HIGH-IMP-
DC-POS
V
IN_P
= V
IN_N
= 0 to +200mV, input
terminations not powered
50 kΩ
Common-Mode Resistance
to GND
Z
RX-HIGH-IMP-
DC-NEG
V
IN_P
= V
IN_N
= -150mV to 0, input terminations
not powered
1kΩ
Common-Mode Resistance
to GND, Input Terminations
Powered
Z
RX-DC
DC 40 50 60 Ω
Output Short-Circuit Current I
TX-SHORT
Single-ended 90 mA
Common-Mode Delta
Between Active and Idle
States
V
TX-CM-DC-
ACTIVE-IDLE-
DELTA
O_AMP = GND 100 mV
DC Output Offset During
Active State
V
TX-CM-DC-
LINE-DELTA
|(V
OUT_P
+ V
OUT_N
)| 25 mV
DC Output Offset During
Electrical Idle
V
TX-IDLE-DIFF-
DC
|(V
OUT_P
+ V
OUT_N
)| 10 mV
AC PERFORMANCE (Note 5)
f = 0.05GHz to 1.25GHz 10
Differential Input Return Loss RL
RX-DIFF
f = 1.25GHz to 2.5GHz 8
dB
Common-Mode Input Return
Loss
RL
RX-CM
f = 0.05GHz to 2.5GHz 6 dB
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.