Datasheet

MAX4950A
Dual PCI Express Equalizer/Redriver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, C
CL
= 75nF coupling capacitor on each output, R
L
= 50Ω resistor on each output, T
A
= 0°C to +70°C, unless
otherwise noted. Typical values are at V
CC
= +3.3V and T
A
= +25°C.) (Note 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
(Voltages referenced to GND.)
V
CC
........................................................................-0.3V to +4.0V
All Other Pins (Note 1)................................-0.3V to (V
CC
+ 0.3V)
Continuous Current IN_P, IN_M, OUT_P, OUT_M ............±30mA
Peak Current IN_P, IN_M, OUT_P, OUT_M
(pulsed for 1µs, 1% duty cycle)..................................±100mA
Continuous Power Dissipation (T
A
= +70°C)
36-Pin TQFN (derate 35.7mW/°C above +70°C) .......2857mW
Junction-to-Case Thermal Resistance (θ
JC
) (Note 2)
36-Pin TQFN...................................................................1°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (Note 2)
36-Pin TQFN.................................................................28°C/W
Operating Temperature Range...............................0°C to +70°C
Junction Temperature Range ............................-40°C to +150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC PERFORMANCE
Power-Supply Range V
CC
3.0 3.6 V
Supply Current I
CC
EN = V
CC
, V
O_AMPA
= V
GND
,
V
O_AMPB
= V
GND
(Note 4)
130 165 mA
Differential Input Impedance Z
RX-DIFF-DC
DC 80 100 120 
Differential Output Impedance Z
TX-DIFF-DC
DC 80 100 120 
Common-Mode Resistance to
GND
Z
RX-HIGH-
IMP-DC-POS
V
IN_P
= V
IN_M
= 0 to +200mV, input
terminations not powered
50 k
Common-Mode Resistance to
GND
Z
RX-HIGH-
IMP-DC-NEG
V
IN_P
= V
IN_M
= -150mV to 0, input
terminations not powered
1 k
Common-Mode Resistance to
GND, Input Terminations Powered
Z
RX-DC
40 50 60 
Output Short-Circuit Current I
TX-SHORT
Single-ended 90 mA
Common-Mode Delta Between
Active and Idle States
V
TX-CM-DC-
ACTIVE-
IDLE-DELTA
V
O_AMP_
= V
GND
100 mV
DC Output Offset During Active
State
V
TX-CM-DC-
LINE-DELTA
|V
OUT_P
- V
OUT_M
| 25 mV
DC Output Offset During
Electrical Idle
V
TX-IDLE-
DIFF-DC
|V
OUT_P
- V
OUT_M
| 10 mV
AC PERFORMANCE
f = 0.05GHz to 1.25GHz 10
Differential Input Return Loss
(Note 5)
RL
RX-DIFF
f = 1.25GHz to 2.5GHz 8
dB
Common-Mode Input Return Loss
(Note 5)
RL
RX-CM
f = 0.05GHz to 2.5GHz 6 dB