Datasheet

MAX4950A
Dual PCI Express Equalizer/Redriver
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
10
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Applications Information
Layout
Circuit-board layout and design can significantly affect
the performance of the MAX4950A. Use good high-fre-
quency design techniques, including minimizing
ground inductance and using controlled-impedance
transmission lines on data signals. It is recommended
to run receive and transmit on different layers to mini-
mize crosstalk and to place power-supply decoupling
capacitors as close as possible to V
CC
. Always con-
nect V
CC
to a power plane.
Exposed Pad Package
The exposed-pad, 36-pin, TQFN package incorporates
features that provide a very low thermal resistance path
for heat removal from the IC. The exposed pad on the
MAX4950A must be soldered to the circuit-board
ground plane for proper thermal performance. For more
information on exposed-pad packages, refer to Maxim
Application Note HFAN-08.1:
Thermal Considerations of
QFN and Other Exposed-Paddle Packages
.
Power-Supply Sequencing
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings
may cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all devices. Always apply GND then V
CC
before apply-
ing signals, especially if the signal is not current limited.
Chip Information
PROCESS: BiCMOS
EN O_AMPB O_AMPA
QUIESCENT POWER
SUPPLY CURRENT
(typ) (mA)
QUIESCENT POWER
SUPPLY CURRENT
(max) (mA)
QUIESCENT POWER
DISSIPATION
(3.3V, typ) (mW)
QUIESCENT POWER
DISSIPATION
(3.6V, max) (mW)
0 0 0 60 75 198 270
0 0 1 55 68 182 243
0 1 0 55 68 182 243
0 1 1 50 60 165 216
1 0 0 130 165 429 594
1 0 1 125 157 413 565
1 1 0 125 157 413 565
1 1 1 120 150 396 540
Table 5. Quiescent Power Dissipation with Equalization and Deemphasis
PCIe
Tx
Rx
NORTHBRIDGE
PCIe X1
CONNECTOR
0.5m TO 2m CABLE
MAX4950A
Figure 3. Typical Application Circuit—MAX4950A Used as X1
Lane Cable Driver
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
36 TQFN T3666+2
21-0141