Datasheet

18 _____________________________________________________________________________________
MAX4936–MAX4939
Octal High-Voltage Transmit/Receive Switches
Application Diagrams (continued)
Figure 9. Interfacing Multiple Devices by Daisy-Chaining
Chip Information
PROCESS: BCDMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-“ in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Figure 8. Ultrasound IMD3 Measurement Technique
MAX4936-
MAX4939
LELE
CLKCLK
CLR
MAX4936-
MAX4939
MAX4936-
MAX4939
LE
CLK
DIN
LE
CLK
DIN
DIN
DIN
CLR CLR CLR
DOUT DOUT DOUT
U_U2U1
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
56 TQFN-EP T56511+1
21-0187 90-0087
ULTRASOUND IMD3
-25dB
F1 - (F2 - F1) F1 F2 F2 + (F2 - F1)