Datasheet

MAX4719
20 Ω , 300MHz Bandwidth, Dual SPDT Analog
Switch in UCSP
2 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +2.7V to +3.6V, V
IH
= +1.4V, V
IL
= +0.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3.0V,
T
A
= +25°C, unless otherwise noted.) (Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All Voltages Referenced to GND)
V+, IN_...................................................................-0.3V to +6.0V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current COM_, NO_, NC_ ...........................±100mA
Peak Current COM_, NO_, NC_
(pulsed at 1ms, 10% duty cycle)................................±200mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
12-Bump UCSP (derate 11.4mW/°C above +70°C) ....909mW
ESD Method 3015.7 ...............................................................2kV
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Bump Temperature (soldering) (Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-
mum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
PARAMETER SYMBOL CONDITIONS T
A
MIN TYP MAX UNITS
Analog Signal Range
V
COM_
,
V
NO_
, V
NC_
T
MIN
to
T
MAX
0V+V
ANALOG SWITCH
+25°C1420
On-Resistance (Note 5) R
ON
V+ = 2.7V, I
COM_
= 10mA;
V
NO_
or V
NC_
= 1.5V
T
MIN
to
T
MAX
25
Ω
+25°C 0.15 0.4
On-Resistance Match Between
Channels (Notes 5, 6)
∆R
ON
V+ = 2.7V, I
COM_
= 10mA;
V
NO_
or V
NC_
= 1.5V
T
MIN
to
T
MAX
0.5
Ω
+25°C 0.6 1.2
On-Resistance Flatness
(Note 7)
R
FLAT
(
ON
)
V+ = 2.7V, I
COM_
= 10mA;
V
NO_
or V
NC_
= 1.0V, 1.5V, 2.0V
T
MIN
to
T
MAX
1.5
Ω
+25°C -0.5 0.01 +0.5
NO_, NC_ Off-Leakage Current
(Note 8)
I
NO_
(
OFF
),
I
NC_
(
OFF
)
V+ = 3.6V, V
COM_
= 0.3V, 3.3V;
V
NO_
or V
NC_
= 3.3V, 0.3V
T
MIN
to
T
MAX
-1 +1
nA
+25°C -1 0.01 +1
COM_ On-Leakage Current
(Note 8)
I
COM_
(
ON
)
V+ = 3.6V, V
COM_
= 0.3V, 3.3V;
V
NO_
or V
NC_
= 0.3V, 3.3V, or
floating
T
MIN
to
T
MAX
-2 +2
nA
DYNAMIC CHARACTERISTICS
+25°C4080
Turn-On Time t
ON
V
NO_
, V
NC_
= 1.5V;
R
L
= 300Ω, C
L
= 35pF, Figure 1
T
MIN
to
T
MAX
100
ns
ABSOLUTE MAXIMUM RATINGS