Datasheet

V
DD
to GND ............................................................-0.3V to +6V
RS+, RS- to GND ..................................................-0.3V to +40V
RS+ to RS- ..........................................................................±40V
OUT, SHDN to GND ................................. -0.3V to (V
DD
+ 0.3V)
Continuous Input Current (any pin) .................................. ±20mA
Continuous Power Dissipation (T
A
= +70°C)
WLP (derate 10.5mW/°C above +70°C) ......................840mW
SOT23 (derate 4.3mW/°C above +70°C) .................347.8mW
Operating Temperature Range ......................... -40°C to +125°C
Junction Temperature ...................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) ....................................... +260°C
WLP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........70°C/W
(Note 1)
(V
DD
= 3.3V, V
CM
= 12V, V
SENSE
= V
FS
/2, V
FS
= (V
DD
- V
OH
- V
OL
)/Gain, V
SHDN
= V
DD
, R
L
= 10kΩ to GND, T
A
= -40°C to +125°C,
unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage V
DD
Guaranteed by PSRR 1.7 5.5 V
Shutdown Supply Current I
SHDN
0.3 0.8 μA
Supply Current I
DD
T
A
= +25°C, R
L
= ∞ 21 31.2
μA
-40°C ≤ T
A
≤ +125°C, R
L
= ∞ 41.5
Power-Supply Rejection
Ratio
PSRR 1.7V ≤ V
DD
≤ 5.5V, V
OUT
= 1V 100 110 dB
Shutdown Voltage Low V
IL
0.55 V
Shutdown Voltage High V
IH
1.3 V
DC CHARACTERISTICS
Input Common-Mode Voltage
Range
V
CM
Guaranteed by CMRR -0.1 +36 V
Common-Mode Rejection
Ratio (Note 5)
CMRR
-0.1V ≤ V
CM
≤ +36V, V
CM
= RS- 91.3 140
dB
+0.1V ≤ V
CM
≤ +36V, V
CM
= RS-
(Note 7)
120 145
Input Bias Current I
RS+
,
I
RS-
2 80 nA
Input Offset Current I
OS
2 50 nA
MAX44284 36V, Input Common-Mode, High-Precision,
Low-Power Current-Sense Amplier
www.maximintegrated.com
Maxim Integrated │ 2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
Package Thermal Characteristics