Datasheet

2Maxim Integrated
MAX44259/MAX44260/MAX44261/MAX44263
1.8V, 15MHz Low-Offset,
Low-Power, Rail-to-Rail I/O Op Amps
IN+, IN-, OUT .................................(V
SS
- 0.3V) to (V
DD
+ 0.3V)
V
DD
to V
SS
...............................................................-0.3V to +6V
SHDN, CAL .............................................................-0.3V to +6V
Output to Short-Circuit Ground Duration .............................. 10s
Continuous Input Current into Any Pin ............................ Q20mA
Continuous Power Dissipation (T
A
= +70NC)
SC70 (derate 3.1mW/NC above +70NC) ......................245mW
SOT23 (derate 3.9mW/NC above +70NC) ................. 312.6mW
6-Pin Thin µDFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC) .............................110.2mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SC70
Junction-to-Ambient Thermal Resistance (B
JA
) .... 326.5NC/W
Junction-to-Case Thermal Resistance (B
JC
) .............115NC/W
SOT23
Junction-to-Ambient Thermal Resistance (B
JA
) .... 255.9NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............81NC/W
Thin µDFN (Ultra-Thin LGA)
Junction-to-Ambient Thermal Resistance (B
JA
) ....... 470NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
DD
= 3.3V, V
SS
= 0V, V
IN+
= V
IN-
= V
DD
/2, R
L
= 10kI to V
DD
/2, V
CAL
= V
SHDN
= V
DD
, T
A
= -40NC to +125NC. Typical values are
at T
A
= +25NC, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Input Voltage Range VIN+ VIN- Guaranteed by CMRR test -0.1
VDD
+ 0.1
V
Input Offset Voltage (Note 3) VOS
TA = +25NC 10 50
FV
TA = -40°C to +125°C after calibration 100
TA = -40°C to
+125°C
MAX44260/MAX44261 500
MAX44259/MAX44263 800
Input Offset Voltage Drift
(Note 3)
VOS - TC
MAX44260/MAX44261 0.8 5
FV/NC
MAX44259/MAX44263 1 8
Input Bias Current (Note 3) IB
TA = +25NC
MAX44259/
MAX44260/MAX44261
0.01 0.5
pA
MAX44263 0.01 0.5
TA = -40NC to +85NC 10
TA = -40NC to
+125NC
MAX44259/
MAX44260/MAX44261
100
MAX44263 160
Input Capacitance CIN 0.4 pF
Common-Mode Rejection Ratio CMRR VCM = -0.1V to (VDD + 0.1V) 75 90 dB