Datasheet

2Maxim Integrated
MAX44244/MAX44245/MAX44248
36V, Precision, Low-Power, 90µA,
Single/Quad/Dual Op Amps
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
V
DD
to V
SS
............................................................-0.3V to +40V
Common-Mode Input Voltage ........(V
SS
- 0.3V) to (V
DD
+ 0.3V)
Differential Input Voltage IN_+, IN_- ......................................6V
Continuous Input Current Into Any Pin ........................... Q20mA
Output Voltage to V
SS
(OUT_) ................– 0.3V to (V
DD
+ 0.3V)
Output Short-Circuit Duration (OUT_) ..................................... 1s
Operating Temperature Range ........................ -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
DD
= 10V, V
SS
= 0V, V
IN+
= V
IN-
= V
DD
/2, R
L
= 5kI to V
DD
/2, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are
at +25NC.) (Note 2)
SO-8
Junction-to-Ambient Thermal Resistance (B
JA
) ........132NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............38NC/W
SO-14
Junction-to-Ambient Thermal Resistance (B
JA
) ........120NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............37NC/W
SOT23
Junction-to-Ambient Thermal Resistance (B
JA
) .....324.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............82NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) ........110NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............30NC/W
FMAX
Junction-to-Ambient Thermal Resistance (B
JA
) .....206.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............42NC/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage Range V
DD
Guaranteed by PSRR 2.7 36 V
Power-Supply Rejection Ratio
(Note 3)
PSRR
T
A
= +25NC, V
IN+
= V
IN-
= V
DD
/2 - 1V 140 148
dB
-40NC < T
A
< +125NC 133
Quiescent Current Per Amplifier
(MAX4244 Only)
I
DD
T
A
= +25NC 100 160
FA
-40NC < T
A
< +125NC 190
Quiescent Current Per Amplifier
(MAX44245/MAX44248 Only)
I
DD
T
A
= +25NC 90 130
FA
-40NC < T
A
< +125NC 145
DC SPECIFICATIONS
Input Common-Mode Range V
CM
Guaranteed by CMRR test
V
SS
-
0.05
V
DD
-
1.5
V