Datasheet

MAX4409
80mW, DirectDrive, Stereo Headphone
Amplifier with Common-Mode Sense
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
PVDD
= V
SVDD
= 3V, V
PGND
= V
SGND
= 0, SHDN = SV
DD
, C1 = C2 = 2.2µF, R
IN
= R
F
= R1 = R2 = 10kΩ, R
L
= ∞, T
A
= T
MIN
to
T
MAX
, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PGND to SGND .....................................................-0.3V to +0.3V
PV
DD
to SV
DD .................................................................
-0.3V to +0.3V
PV
SS
to SV
SS
.........................................................-0.3V to +0.3V
PV
DD
and SV
DD
to PGND or SGND .........................-0.3V to +4V
PV
SS
and SV
SS
to PGND or SGND ..........................-4V to +0.3V
IN_ and COM to SGND.................................SV
SS
to (SV
DD
- 1V)
IN_ to COM .....................................(COM + 2V) to (COM - 0.3V)
SHDN_ to SGND........................(SGND - 0.3V) to (SV
DD
+ 0.3V)
OUT_ to SGND ............................(SV
SS
- 0.3V) to (SV
DD
+ 0.3V)
C1P to PGND.............................(PGND - 0.3V) to (PV
DD
+ 0.3V)
C1N to PGND .............................(PV
SS
- 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or V
DD
...........................Continuous
Thermal Limits (Note 1)
Continuous Power Dissipation (T
A
= +70°C)
20-Pin Thin QFN Multilayer (derate 25.6mW/°C
above +70°C)..........................................................2051mW
θ
JA
................................................................................39°C/W
θ
JC
...............................................................................5.7°C/W
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range V
DD
Guaranteed by PSRR test 1.8 3.6 V
Quiescent Supply Current I
DD
5 8.4 mA
Shutdown Supply Current I
SHDN
SHDN = GND 6 10 µA
V
IH
0.7 x
SV
DD
SHDN Thresholds
V
IL
0.3 x
SV
DD
V
SHDN Input Leakage Current -1 +1 µA
SHDN to Full Operation t
SON
175 µs
CHARGE PUMP
Oscillator Frequency f
OSC
272 320 368 kHz
AMPLIFIERS
Input Offset Voltage V
OS
R
L
= 32Ω 0.5 2.4 mV
Input Bias Current I
BIAS
-700 -100 0 nA
COM Bias Current I
COM
-1400 -200 0 nA
Equivalent Input Offset Current I
OS
I
OS
= (I
BIAS(INR)
+ I
BIAS(INL)
- I
COM
) / 2 ±2 nA
COM Input Range V
COM
Inferred from CMRR test -500 +500 mV
Common-Mode Rejection Ratio CMRR -500mV ≤ V
COM
≤ +500mV, R
SOURCE
≤ 10Ω 75 96 dB
1.8V ≤ V
DD
≤ 3.6V DC (Note 3) 75 86
f
RIPPLE
= 1kHz 76Power-Supply Rejection Ratio PSRR
V
DD
= 3.0V,
200mV
P-P
ripple (Note 4)
f
RIPPLE
= 20kHz 48
dB
R
L
= 32Ω 65
Output Power P
OUT
THD+N = 1%, T
A
= +25°C
R
L
= 16Ω 55 80
mW
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations see www.maxim-ic.com/thermal-tutorial
.