Datasheet

MAX4364/MAX4365
1.4W and 1W, Ultra-Small, Audio Power
Amplifiers with Shutdown
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, OUT_ to GND...................................................-0.3V to +6V
IN+, IN-, BIAS, SHDN to GND....................-0.3V to (V
CC
+ 0.3V)
Output Short Circuit (OUT+ to OUT-) (Note 1)...........Continuous
Continuous Power Dissipation (T
A
= +70°C)
8-Pin µMAX (derate 4.8mW/°C above +70°C) ..............388mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
8-Pin SO (derate 7.8mW/°C above +70°C)...................623mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
ELECTRICAL CHARACTERISTICS—5V
(V
CC
= 5V, R
L
= ∞, C
BIAS
= 1µF to GND, V
SHDN
= V
GND
, T
A
= +25°C, unless otherwise noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range V
CC
Inferred from PSRR test 2.7 5.5 V
MAX4364 7 13
M AX 4364, T
A
= T
M IN
to T
M AX
17
M AX 4365 5 8
Supply Current I
CC
(Note 4)
M AX 4365, T
A
= T
M IN
to T
M AX
11
mA
Shutdown Supply Current I
SHDN
V
SHDN
= V
CC
0.01 4 µA
T
A
= +25°C
V
CC
x
0.7
V
IH
T
A
= -40°C to +85°C
(Note 5)
V
CC
x
0.7
T
A
= +25°C
V
CC
x
0.3
SHDN Threshold
V
IL
T
A
= -40°C to +85°C
(Note 5)
V
CC
x
0.3
V
Common-Mode Bias Voltage V
BIAS
(Note 6)
V
CC
/2 -
5%
V
CC
/2
V
CC
/2
+ 5%
V
Output Offset Voltage V
OS
IN- = OUT+, IN+ = BIAS (Note 7) ±1 ±10 mV
V
CC
= 2.7V to 5.5V DC 55 75
217Hz 68
Power-Supply Rejection Ratio PSRR
V
RIPPLE
= 200mV
P-P
,
R
L
= 8Ω
1kHz 58
dB
MAX4364 1200 1400
Output Power P
OUT
R
L
= 8Ω, THD+N = 1%,
f
IN
= 1kHz (Note 8)
MAX4365 800 1000
mW
Note 1: Continuous power dissipation must also be observed.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
µMAX
Junction-to-Ambient Thermal Resistance (
θ
JA
) ......206.3°C/W
Junction-to-Case Thermal Resistance (
θ
JC
)................42°C/W
TDFN
Junction-to-Ambient Thermal Resistance (
θ
JA
) ...........41°C/W
Junction-to-Case Thermal Resistance (
θ
JC
)..................8°C/W
SO
Junction-to-Ambient Thermal Resistance (
θ
JA
) ......128.4°C/W
Junction-to-Case Thermal Resistance (
θ
JC
)................36°C/W