Datasheet
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MAX4350/MAX4351
Ultra-Small, Low-Cost, 200MHz, Dual-Supply
Op Amps with Rail-to-Rail Outputs
SOT23, 8L .EPS
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
3.002.60E
C
E1
E
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
8. MEETS JEDEC MO178.
8∞
0.60
1.75
0.30
L2
0∞
e1
e
L
1.50E1
0.65 BSC.
1.95 REF.
0.25 BSC.
GAUGE PLANE
SEATING PLANE C
C
L
PIN 1
I.D. DOT
(SEE NOTE 6)
L
C
L
C
A2
e1
D
DETAIL "A"
5. COPLANARITY 4 MILS. MAX.
NOTE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
6. PIN 1 I.D. DOT IS 0.3 MM ÿ MIN. LOCATED ABOVE PIN 1.
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
1. ALL DIMENSIONS ARE IN MILLIMETERS.
L2
L
A1
A
0.45
1.30
0.15
1.45
MAX
0.28b
0.90A2
0.00A1
0.90
A
MIN
SYMBOL
3.00
0.20
2.80D
0.09
C
SEE DETAIL "A"
L
C
b
e
D
1
21-0078
1
PACKAGE OUTLINE, SOT-23, 8L BODY
0
0
SOICN .EPS
PACKAGE OUTLINE, .150" SOIC
1
1
21-0041
B
REV.DOCUMENT CONTROL NO.APPROVAL
PROPRIETARY INFORMATION
TITLE:
TOP VIEW
FRONT VIEW
MAX
0.010
0.069
0.019
0.157
0.010
INCHES
0.150
0.007
E
C
DIM
0.014
0.004
B
A1
MIN
0.053A
0.19
3.80 4.00
0.25
MILLIMETERS
0.10
0.35
1.35
MIN
0.49
0.25
MAX
1.75
0.050
0.016L
0.40 1.27
0.3940.386D
D
MINDIM
D
INCHES
MAX
9.80 10.00
MILLIMETERS
MIN
MAX
16
AC
0.337 0.344 AB8.758.55 14
0.189 0.197 AA5.004.80 8
N MS012
N
SIDE VIEW
H 0.2440.228 5.80 6.20
e 0.050 BSC 1.27 BSC
C
HE
e
B
A1
A
D
0∞-8∞
L
1
VARIATIONS:
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)