Datasheet
MAX3969
Applications Information
Wire Bonding
For high-current density and reliable operation, the
MAX3969 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Use caution if
attempting wedge bonding. Die pad size is 4 mils x 4
mils. Die thickness is 16 mils.
Table 1 lists the bond pad coordinates for the MAX3969.
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin and indicate the center of the
pad where the bond wire should be connected. Refer to
Maxim Application Note HFAN-08.0.1: Understanding
Bonding-Coordinates and Physical Die Size for detailed
information.
200Mbps SFP Limiting Amplifier
8 _______________________________________________________________________________________
COORDINATES (μm)
PAD NAME
XY
1 INV 46.6 659.5
2 FILTER 46.6 505.6
3 RSSI 46.6 351.7
4 IN- 46.6 197.8
5 IN+ 46.6 46.6
6 GND 195.1 -99.1
7 GND 432.7 -99.1
8 GND 589.3 -99.1
9 CZP 743.2 -99.1
10 CZN 945.7 -99.1
11 V
CCO
1204.9 -96.4
12 OUT+ 1204.9 81.7
13 OUT- 1204.9 262.6
14 SD 1204.9 492.1
15 LOS 1204.9 697.3
16 LOS 1053.7 818.8
17 V
CC
808.0 818.8
18 V
CC
586.6 818.8
19
SQUELCH
432.7 818.8
20 V
TH
195.1 818.8
Table 1. Bond Pad Coordinates
CONNECT EXPOSED PAD (EP) TO CIRCUIT BOARD GROUND.
19 18 17
V
TH
SQUELCH
V
CC
V
CC
16
LOS
13
12
11
14
15
OUT+
OUT-
SD
LOS
V
CCO
4
3
2
1
IN-
RSSI
FILTER
INV
5IN+
6789
GND
GND
GND
CZP
10
CZN
MAX3969
TOP VIEW
THIN QFN
Pin Configuration
Chip Information
TRANSISTOR COUNT: 915
SUBSTRATE CONNECTED TO GND
PROCESS: Silicon Bipolar
DIE THICKNESS: 16 mils