Datasheet

Applications Information
Wire-Bonding Die
The MAX3967A utilizes gold metalization, which pro-
vides high reliability. Make connections to the die with
gold wire only, using ball-bonding techniques. Use
caution if attempting wedge-bonding. Pad size is 4 mils
x 4 mils (100µm). Die thickness is typically 15 mils
(375µm).
Exposed-Pad Package
The exposed pad on the 24-pin TQFN provides a very
low thermal resistance path for heat removal from
the IC.
Chip Information
TRANSISTOR COUNT: 331
SUBSTRATE CONNECTED TO V
EE
PROCESS: BIPOLAR
DIE THICKNESS: 15 mils
MAX3967A
270Mbps SFP LED Driver
_______________________________________________________________________________________ 9
Input Terminations
PECL
OUTPUT
IN+
V
CC
V
CC
V
CC
- 2V
50Ω
3.3 82 130
R1 R2
5.0 68 180
R1
R2
RF OR NON-PECL
OUTPUT
IN+
SINGLE-ENDED TERMINATION IS SHOWN. IN- SHOULD BE TERMINATED SIMILARLY.
MAX3967A
MAX3967A
Figure 3. Input Terminations